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IC Letter Grinding Machine
IC Forming Machine
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IC Letter Grinding Machine
ICF-840

Features:
  1. To be able thoroughly grind off the letters on the surface of IC to prevent the circuit board from being counterfeited.
  2. To use automatic material feeding and recovering without hand touching the material to prevent form electrostatic interference.
  3. To grind with special grinding wheel plate without causing surface being heated, the depth of the grinding may be micro-adjusted.
  4. To fit with diamond rectify to adjust the plane of the grinding wheel plate at any time when necessary.
  5. With small volume and high production efficiency, The productivity of one machine is equivalent to five skilled labors.
  6. The machine is suitable for D.I.P IC type and S.M.D. IC type.
    (SOP, SOJ and PLCC type etc.)

Type

ICF-840
Power Source AC110V/60HZ or AC220V/50Hz
Cutting Speed 14 Pin 300PCS/Min
Dimensions L450 x W400 x H450m/m
Weight 35Kgs


SENTRY YARN ENTERPRISE CO., LTD.
No.10, Lane 36, Hua Chern Rd., Hsin-Chuang City, Taipei Hsien, Taiwan, R.O.C.
TEL:886-2-2997-8234 . 2991-0137
FAX:886-2-2996-4539
http://www.sentry.com.tw
E-mail:sentrya@ms41.hinet.net 　


 
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